Title:
COMPOSITION AND PHOTOSENSITIVE COMPOSITION
Document Type and Number:
Japanese Patent JP2023046246
Kind Code:
A
Abstract:
To provide a photosensitive composition hardly causing an excessive decrease in the weight of components in the composition or photosensitive composition (components other than a solvent if the composition or photosensitive composition contains the solvent) even if heated, and allowing inorganic fine particles to be stably dispersed for a long period of time, a cured product of the photosensitive composition, a compound which is favorably contained in the photosensitive composition, and a method for producing the compound.SOLUTION: The present invention provides either a composition which contains a photopolymerizable compound (A) and inorganic fine particles (B), or a photosensitive composition which contains a photopolymerizable compound (A), inorganic fine particles (B) and an initiator (C), where a compound that has a specific structure with a radically polymerizable group-containing group or a cationically polymerizable group-containing group is used as the photopolymerizable compound (A).SELECTED DRAWING: None
Inventors:
Ryutaro Sugawara
Takuro Asaba
Takuro Asaba
Application Number:
JP2022102743A
Publication Date:
April 03, 2023
Filing Date:
June 27, 2022
Export Citation:
Assignee:
Tokyo Ohka Kogyo Co., Ltd.
International Classes:
C08F20/38; C07C319/20; C07C323/20; C07C323/64; C08F2/44; C08G59/02; C08K3/013; C08K3/08; C08K3/22; C08L33/14; C08L63/00
Attorney, Agent or Firm:
Masayuki Masabayashi
Hayashi Kazuyoshi
Hayashi Kazuyoshi