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Patent Searching and Data


Title:
COMPOSITION FOR POLISHING METAL FILM
Document Type and Number:
Japanese Patent JP2006228823
Kind Code:
A
Abstract:

To provide a composition for polishing a metal film of which the selectivity can be controlled to any value.

The composition for polishing a metal film contains fumed silica as abrasive grains. The specific surface area of the fumed silica is not less than 50 m2/g nor more than 190 m2/g, and a half-value width in the particle size distribution is less than 0.1 μm. By adjusting the specific surface area and the half-value width in the particle size distribution of the fumed silica within a predetermined range, the selectivity which is a ratio of a metal film polishing speed to an oxide film polishing speed can be controlled to any value.


Inventors:
OTA KEIJI
TANAKA TOSHIKA
NITTA HIROSHI
MORIOKA YOSHITAKA
Application Number:
JP2005038105A
Publication Date:
August 31, 2006
Filing Date:
February 15, 2005
Export Citation:
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Assignee:
NITTA HAAS INC
International Classes:
H01L21/304; B24B37/00; C09K3/14
Attorney, Agent or Firm:
西教 圭一郎
杉山 毅至
廣瀬 峰太郎