Title:
COMPOSITION FOR POLISHING
Document Type and Number:
Japanese Patent JP2001139935
Kind Code:
A
Abstract:
To obtain a polishing composition which has an excellent polishing performance, is suitable for flattening the surfaces of wafers for semiconductor devices, and consists mainly of Al2O3/SiO2 compound particles.
The composition for polishing comprises deionized water, an additive and metal oxide particles consisting essentially of the Al2O3/SiO2 compound.
Inventors:
RI KICHISEI
KIN SEKICHIN
RI ZAISHAKU
CHUNG TU-WON
KIN SEKICHIN
RI ZAISHAKU
CHUNG TU-WON
Application Number:
JP2000233384A
Publication Date:
May 22, 2001
Filing Date:
August 01, 2000
Export Citation:
Assignee:
CHEIL IND CO LTD
International Classes:
B24B37/00; C09G1/02; C09K3/14; C09K13/02; C09K13/04; C09K13/06; H01L21/304; H01L21/321; (IPC1-7): C09K3/14; B24B37/00; C09K13/02; H01L21/304
Domestic Patent References:
| JPH0812319A | 1996-01-16 | |||
| JPH09321003A | 1997-12-12 | |||
| JPH0198698A | 1989-04-17 | |||
| JPS52112886A | 1977-09-21 | |||
| JPH11228123A | 1999-08-24 | |||
| JPH06199516A | 1994-07-19 |
Attorney, Agent or Firm:
Yamato Tsutsui (1 person outside)
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