Title:
COMPOSITION FOR THERMOPLASTIC MOLDING
Document Type and Number:
Japanese Patent JPH04314753
Kind Code:
A
Abstract:
PURPOSE: To provide a thermoplastic molding composition comprising a polyoxymethylene polymer, a polyester, etc., and showing balanced properties, especially heat stability, rigidity, toughness, surface properties, for example printability, bondability, coatability and electroplatability.
CONSTITUTION: This composition mainly comprises 2-97.5 wt.% polyoxymethylene homopolymer or copolymer, 2-97.5 wt.% polyester, 0-95.5 wt.% polyamide, 0.5-25 wt.% 2,2-di(4-hydroxyphenyl)propane/epichlorohydrin polycondensate, 0-60 wt.% high-impact modified polymer, 0-70 wt.% polycarbonate and 0-60 wt.% fibrous or particulate filler or mixture thereof.
Inventors:
GURAHAMU EDOMONTO MATSUKEE
ZABINE KIIRUHORUN
ZUIIKUBERUTO BOONETSUTO
HARUTOMUUTO TSUAINAA
ZABINE KIIRUHORUN
ZUIIKUBERUTO BOONETSUTO
HARUTOMUUTO TSUAINAA
Application Number:
JP28458091A
Publication Date:
November 05, 1992
Filing Date:
October 30, 1991
Export Citation:
Assignee:
BASF AG
International Classes:
C08L23/16; C08L59/00; C08L63/00; C08L67/00; C08L67/02; C08L69/00; C08L71/00; C08L71/02; C08L71/08; C08L77/00; D01F6/88; C08L33/04; C08L51/04; (IPC1-7): C08L23/16; C08L59/00; C08L67/00; C08L69/00; C08L71/08; C08L77/00; D01F6/88
Attorney, Agent or Firm:
Tajiro Taiji