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Title:
COMPOSITION FOR THREE-DIMENSIONAL MOLDING, FILAMENT FOR THREE-DIMENSIONAL MOLDING, AND MOLDED BODY
Document Type and Number:
Japanese Patent JP2023124604
Kind Code:
A
Abstract:
To provide a composition for three-dimensional molding with suppressed deformation caused by heat shrinkage of a thermoplastic resin to such an extent that can produce a highly accurate molded body.SOLUTION: A composition for three-dimensional molding includes: 45-75 pts. mass of 4-methyl-1-pentene-based polymer (A) which satisfies (A-a) and (A-b); and 25-55 pts.mass of 4-methyl-1-pentene-based polymer (B) which satisfies (B-a) and (B-b) (provided that the total of 4-methyl-1-pentene-based polymer (A) and 4-methyl-1-pentene-based polymer (B) is 100 pts.mass.), where the tensile elastic modulus is 10-1,000 MPa. (A-a): (A) comprises 90-100 mol% of a constitutional unit (i) derived from 4-methyl-1- pentene, and 0-10 mol% of a constitutional unit (ii) derived from C5-20 α-olefin (excluding 4-methyl-1-pentene) (provided that the total of the constitutional unit (i) and the constitutional unit (ii) is 100 mol%). (A-b): The melting point (Tm) measured by a differential scanning calorimeter (DSC) is within a range of 200-250°C. (B-a): (B) comprises 60-78 mole% of a constitutional unit (iii) derived from 4-methyl-1-pentene, and 22-40 mol% of a constitutional unit (iv) derived from C2-4 α-olefin (provided that the total of the constitutional unit (iii) and the constitutional unit (iv) is 100 mol%). (B-b): the melting point (Tm) measured by a differential scanning calorimeter (DSC) is not observed.SELECTED DRAWING: None

Inventors:
MIYATAKE HIROYUKI
TANAKA MASAKAZU
SHIODE HIROHISA
Application Number:
JP2022028474A
Publication Date:
September 06, 2023
Filing Date:
February 25, 2022
Export Citation:
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Assignee:
MITSUI CHEMICALS INC
International Classes:
C08L23/20; B29C64/118; B29C64/314; B33Y10/00; B33Y40/10; B33Y80/00; C08F210/14
Attorney, Agent or Firm:
Patent Attorney Corporation SS International Patent Office