Title:
エチレンコポリマー及びポリオレフィンを含む組成物
Document Type and Number:
Japanese Patent JP2007522276
Kind Code:
A
Abstract:
Disclosed are compositions of ethylene/(meth)acrylate copolymers, polyolefins (e.g., polyethylene and polypropylene), optional tackifier resins and optional fillers that provide very strong, tight hermetic heat seals yet are easily peelable. These compositions are useful as an adhesive layer in multilayer structures that are useful as packaging lidding films. Also disclosed are packages that comprise these multilayer structures.
Inventors:
Kendi Terrance Dee
Tanny Stephen Earl
Tanny Stephen Earl
Application Number:
JP2006549478A
Publication Date:
August 09, 2007
Filing Date:
January 06, 2005
Export Citation:
Assignee:
E.I.DU PONT DE NEMOURS AND COMPANY
International Classes:
C08L23/00; B32B27/08; B32B27/28; B65D1/00; B65D30/02; B65D65/40; B65D75/36; C08J5/18; C08K3/00; C08L23/08; C08L33/02; C09D123/08; C09J123/08
Domestic Patent References:
| JPS61183371A | 1986-08-16 | |||
| JP2002146122A | 2002-05-22 | |||
| JP2005524734A | 2005-08-18 | |||
| JP2002505692A | 2002-02-19 | |||
| JPH10147672A | 1998-06-02 |
Attorney, Agent or Firm:
Sadao Kumakura
Nobuo Ogawa
Atsushi Hakoda
Kenji Asai
Koji Hirayama
Nobuo Ogawa
Atsushi Hakoda
Kenji Asai
Koji Hirayama