Title:
エチレンコポリマー及びポリオレフィンを含む組成物
Document Type and Number:
Japanese Patent JP4940137
Kind Code:
B2
Abstract:
Disclosed is the use of compositions of ethylene copolymers, polyolefins (for example, polyethylene and polypropylene), tackifiers and optional fillers that provide strong hermetic adhesion to impact-modified acrylonitrile-methylacrylate copolymers. These compositions are useful as an adhesive layer in multilayer structures prepared by coextrusion, extrusion coating and extrusion lamination. Also disclosed are packages, such as thermoformed blister packs, rigid containers and pouches that comprise these multilayer structures.
Inventors:
Kendi Terrance Dee
Tanny Stephen Earl
Tanny Stephen Earl
Application Number:
JP2007521640A
Publication Date:
May 30, 2012
Filing Date:
July 13, 2005
Export Citation:
Assignee:
E.I.DU PONT DE NEMOURS AND COMPANY
International Classes:
B32B27/30; B23B27/08; B32B27/32; B65D43/00; B65D53/00; C08J7/04; C08L23/00; C08L23/02; C08L45/00; C08L49/00; C08L65/00; C08L93/04
Domestic Patent References:
| JP10147672A | ||||
| JP61183371A | ||||
| JP2002505692A | ||||
| JP2007522276A | ||||
| JP10279774A | ||||
| JP5641161A |
Foreign References:
| US4786534 | ||||
| WO1999052972A2 |
Attorney, Agent or Firm:
Sadao Kumakura
Nobuo Ogawa
Atsushi Hakoda
Kenji Asai
Koji Hirayama
Nobuo Ogawa
Atsushi Hakoda
Kenji Asai
Koji Hirayama