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Title:
銅酸化物を金属銅に還元するための組成物および方法
Document Type and Number:
Japanese Patent JP3718722
Kind Code:
B2
Abstract:
A composition for reducing a copper oxide layer to metallic copper so as to facilitate bonding a resin to the metallic copper is disclosed. The composition is an aqueous reducing solution containing a cyclic borane compound. Examples of such cyclic borane compounds include those having nitrogen or sulfur as a ring- forming member, such as morpholine borane, piperidine borane, pyridine borane, piperazine borane, 2,6-lutidine borane, 4-methylmorpholine borane, and 1,4-oxathiane borane, and also N,N-diethylaniline borane.

Inventors:
John Fuckler
Rush, michael
Campbell, Scott
Application Number:
JP55034098A
Publication Date:
November 24, 2005
Filing Date:
February 20, 1998
Export Citation:
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Assignee:
Morton International, Inc.
International Classes:
C07D295/02; B05D3/00; B05D5/00; C01B6/06; C07D213/18; C07D327/06; C07F5/02; C22B5/00; C22B15/00; C23C22/63; C23C22/83; C23F3/00; C23G1/20; H05K3/38; (IPC1-7): C22B5/00; C01B6/06
Domestic Patent References:
JP61176192A
JP6010146A
JP4096293A
JP61221394A
JP6342485A
JP462047A
JP3129793A
JP5129249A
Foreign References:
WO1997049841A1
Attorney, Agent or Firm:
Takashi Ishida
Yoshio Yoshio
Masaya Nishiyama
Higuchi Souji