Title:
組成物、ペースト、及び方法
Document Type and Number:
Japanese Patent JP7219355
Kind Code:
B2
Abstract:
A composition for sealing inorganic substrates, the composition comprising a glass frit and a filler material, wherein said glass frit comprises: 60 to 85 wt % Bi2O3; 3 to 15 wt % ZnO; 2 to 10 wt % B2O3; 0.6 to 5 wt % SiO2; 0.6 to 5 wt % Al2O3; and 0.1 to 0.5 wt % of a compound selected from NaF and BaF2.
Inventors:
Curry, Edwin Peter Kennedy
Emelianova, Svetlana N.
Ren, Hong
Valla, Maxence
Emelianova, Svetlana N.
Ren, Hong
Valla, Maxence
Application Number:
JP2021574182A
Publication Date:
February 07, 2023
Filing Date:
June 19, 2020
Export Citation:
Assignee:
Fenzi AGT Netherlands B.V.
International Classes:
C03C8/24; C03C8/14; C03C8/16; C03C8/22
Domestic Patent References:
| JP2007169162A | ||||
| JP2003034550A | ||||
| JP2009120462A | ||||
| JP2013514956A | ||||
| JP2000211942A | ||||
| JP9278483A | ||||
| JP2011046601A | ||||
| JP2006524419A | ||||
| JP2014534145A |
Attorney, Agent or Firm:
Yamato Kento
Haruhiko Ema
Haruhiko Ema