Title:
COMPOUND FOR ACTIVATION OF SUBSTRATE SURFACE FOR NON-CURRENT METALLIZATION
Document Type and Number:
Japanese Patent JP2515463
Kind Code:
B2
Abstract:
PURPOSE: To form a metallic layer having high adhesive power without electrolysis on the surface of a high-polymer material by activating the surface of the high-polymer material with a mixture composed of a specific org. noble metal compd., fillers, solvent and binder as an activating agent.
CONSTITUTION: At the time of forming the thin-film layer of the metal without electrolysis on the surface of the high-polymer material, such as plastic, the surface is previously subjected to the activation treatment. The conditioning agent prepd. by mixing and dissolving 0.03 to 3.0 pts.wt. org. compd. of noble metals, such a Pd, as the activating agent, 0.5 to 3.0 pts.wt. dispersible silicic acid, etc., as the fillers, 10 to 30 pts.wt. solvent, such as ethanol, and 12 to 18 pts.wt. binder consisting of a polyurethane polymer as an aq. dispersion, is used and is sprayed to the surface of the plastic material to adhere the noble metal, such as Pd, as the activating metal and thereafter, the plastic material is immersed into an electroless plating liquid of, for example, Cu, Ni, etc., by which the metallic layer of Cu, etc., is formed with the excellent adhesive power on the surface of the nonconductive material, such as plastic.
Inventors:
GYUNTAA RAIHERUTO
FURANKU KOBERUKA
GERUHARUTOODEIITAA BORUFU
URURITSUHI FUON GITSUIKI
FURANKU KOBERUKA
GERUHARUTOODEIITAA BORUFU
URURITSUHI FUON GITSUIKI
Application Number:
JP11233992A
Publication Date:
July 10, 1996
Filing Date:
April 06, 1992
Export Citation:
Assignee:
BAYER AG
International Classes:
C23C18/28; C23C18/30; (IPC1-7): C23C18/30
Domestic Patent References:
| JP1312080A | ||||
| JP21913B2 |
Attorney, Agent or Firm:
Heiyoshi Odashima