PURPOSE: To enhance an elastic modulus of a diamond bit itself and also enhance grinding accuracy by dispersing, in a resin bond basic matrix, vitrified bond particles holding abrasive grains.
CONSTITUTION: The captioned diamond grindstone is provided by dispersing vitrified bond particles 2 holding abrasive grains 3 in a resin bond 1. In grinding ceramic with the use of such a diamond grindstone, cutting edges in the grindstone is promotely generated, thereby the ceramic can be ground with high efficiency while, with the grinding surface having hardness more than that of a resin bond area 1, the grinding surface is subjected to deformed wear so that it is possible to reduce generation of waviness of the grinding surface, resuting in enhanced grinding accuracy.
JP2000061848 | POLISHING SHEET |
JP5398132 | Grinding whetstone |
JP3004988 | [Title of Invention] Polishing Tool |