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Title:
COMPOUND BOND DIAMOND GRINDSTONE AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JP01183370
Kind Code:
A
Abstract:

PURPOSE: To enhance an elastic modulus of a diamond bit itself and also enhance grinding accuracy by dispersing, in a resin bond basic matrix, vitrified bond particles holding abrasive grains.

CONSTITUTION: The captioned diamond grindstone is provided by dispersing vitrified bond particles 2 holding abrasive grains 3 in a resin bond 1. In grinding ceramic with the use of such a diamond grindstone, cutting edges in the grindstone is promotely generated, thereby the ceramic can be ground with high efficiency while, with the grinding surface having hardness more than that of a resin bond area 1, the grinding surface is subjected to deformed wear so that it is possible to reduce generation of waviness of the grinding surface, resuting in enhanced grinding accuracy.


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Inventors:
Mikuni, Kiwa
Application Number:
JP1988000004383
Publication Date:
July 21, 1989
Filing Date:
January 11, 1988
Export Citation:
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Assignee:
NORITAKE DIA KK
International Classes:
B24D3/00; B24D3/14; B24D3/28; B24D3/00; B24D3/04; B24D3/20; (IPC1-7): B24D3/00; B24D3/14; B24D3/28



 
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