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Title:
COMPOUND FOR FORMING HEAT-DISSIPATION MATERIAL
Document Type and Number:
Japanese Patent JP2009102234
Kind Code:
A
Abstract:

To provide a compound for forming a heat-dissipation material, which has high thermal conductivity without the addition of a heat-conductive filler and forms a heat-dissipation material having excellent moldability and adhesivity.

The compound for forming a heat-dissipation material is a borazine ring-containing compound for forming a heat-dissipation material, in which one or more of boron atoms and nitrogen atoms of borazine skeleton constituting the borazine ring have substituent groups except a hydrogen atom.


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Inventors:
OKAJIMA MASAYUKI
YAMAMOTO TETSUYA
KAMIYAMA TAKUYA
Application Number:
JP2007273232A
Publication Date:
May 14, 2009
Filing Date:
October 20, 2007
Export Citation:
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Assignee:
NIPPON CATALYTIC CHEM IND
International Classes:
C07F5/05; C08G79/08; C08K5/00; C08L85/04; C09K5/08; H01L21/312; H01L21/318; H01L23/373
Domestic Patent References:
JP2009102462A2009-05-14
JP2005162806A2005-06-23
JP2005162807A2005-06-23
JP2005162806A2005-06-23
JP2005162807A2005-06-23
JP2006005090A2006-01-05
JP2003119289A2003-04-23
JP2006080569A2006-03-23
JP2008311548A2008-12-25
Foreign References:
WO2006043432A12006-04-27
Attorney, Agent or Firm:
Hatta International Patent Corporation



 
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