To provide a compound lens manufacturing method capable of preventing attachment of dust and chips to a surface of a wafer lens.

Attachment of dust to a wafer lens 100 due to static electricity is prevented by applying static elimination processing (step S13) to the wafer lens 100. Chips generated at the time of dicing (step S15) are easily washed off by executing hydrophilic processing (step S14) before the dicing, and the attachment of chips to a surface of the wafer lens 100 is prevented. As a result, a surface of a compound lens 200 that is a piece cut out of the wafer lens 100 is prevented from being dirty and is prevented from being damaged. Furthermore, reliability of the compound lens 200 being the cutout piece by a temperature cycling test is increased.