Title:
COMPOUND, POLYMER, POLYMERIZABLE COMPOSITION, ADHESIVE, COATING AGENT, CURED PRODUCT AND METHOD FOR PRODUCING CURED PRODUCT
Document Type and Number:
Japanese Patent JP2022158352
Kind Code:
A
Abstract:
To provide a polymerizable composition that is less prone to shrinkage when cured.SOLUTION: A compound has, in each molecule, isocyanurate structures, urethane bonds and one ethylenically unsaturated bond-containing group. A polymerizable composition has: the compound, a polymer derived from the compound as a monomer, or a copolymer derived from the compound and a methacrylate or acrylate compound as monomers; and a polymerization initiator. The ethylenically unsaturated bond-containing group is preferably a vinyl group, an isopropenyl group, an acryloyloxy group or a methacryloyloxy group.SELECTED DRAWING: None
Inventors:
SHINOZUKA TOYOJI
ENDO TAKESHI
OKAMOTO SHUSUKE
ENDO TAKESHI
OKAMOTO SHUSUKE
Application Number:
JP2021063164A
Publication Date:
October 17, 2022
Filing Date:
April 01, 2021
Export Citation:
Assignee:
ADEKA CORP
International Classes:
C07D251/24; C08F20/36; C09D4/00; C09D4/02; C09J4/00; C09J4/02; C09J11/06
Attorney, Agent or Firm:
Patent Attorney Showa International Patent Office
Previous Patent: zero phase current transformer
Next Patent: Semiconductor module and method for manufacturing semiconductor module
Next Patent: Semiconductor module and method for manufacturing semiconductor module