COMPOUND AND POSITIVE TYPE RESIST COMPOSITION CONTAINING THE COMPOUND

Japanese Patent JP2004238304

A

To provide a compound which is suitable for positive type resin compositions and the like for improving the roundness of a contact hole and a rectangular profile, and to provide a positive type resin composition which contains the compound and improves the roundness of a contact hole and a rectangular profile.

This compound having a specific structure is represented by formula (I). This positive type resin composition is characterized by comprising (A) a compound which produces an acid by the irradiation of active rays or radiations, (B) a resin which is insoluble or slightly soluble in an alkali developing liquid and can be dissolved by the action of an acid, and (C) the compound having the specific structure.

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FUJIMORI TORU

JP2003027161A

August 26, 2004

February 04, 2003

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FUJI PHOTO FILM CO LTD

G03F7/004; C07D319/06; G03F7/039; H01L21/027; (IPC1-7): C07D319/06; G03F7/004; G03F7/039; H01L21/027

JP2002229190A	2002-08-14
JP2002169293A	2002-06-14
JP2002131917A	2002-05-09

COLLECTION OF CZECHOSLOVAK CHEMICAL COMMUNICATIONS (1995), 60(4), 605-611, JPN6008066348, ISSN: 0001217443
JOURNAL OF HETEROCYCLIC CHEMISTRY (1993), 30(1), 105-107, JPN6008066349, ISSN: 0001217444
CAPLUS ACCESSION NO　1937:5182（CA ACCESSION NO. 31:5182)（ SCIENCE AND CULTURE (1936), 2, 162) RETR, JPN6008066347, ISSN: 0001217445

Shohei Oguri
Hironori Honda
Toshimitsu Ichikawa
Takeshi Takamatsu
Yuriko Hamada

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