Title:
化合物、樹脂、組成物及びパターン形成方法
Document Type and Number:
Japanese Patent JP7290114
Kind Code:
B2
Abstract:
An object of the present invention is to provide a compound and the like that are applicable to a wet process and are useful for forming a photoresist and an underlayer film for photoresists excellent in heat resistance, solubility, and etching resistance. A compound represented by the following formula (1) can solve the problem described above.
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Inventors:
Masatoshi Echigo
Yu Okada
Tomoaki Takigawa
Takashi Makinoshima
Yu Okada
Tomoaki Takigawa
Takashi Makinoshima
Application Number:
JP2019566518A
Publication Date:
June 13, 2023
Filing Date:
January 18, 2019
Export Citation:
Assignee:
Mitsubishi Gas Chemical Co., Ltd.
International Classes:
C07C321/26; G03F7/11; G03F7/20
Domestic Patent References:
JP2017227810A | ||||
JP2000351846A | ||||
JP2017082205A | ||||
JP2015018220A | ||||
JP2118639A |
Foreign References:
US20180013074 | ||||
US20140319097 | ||||
WO2017018360A1 | ||||
WO2001068595A1 |
Other References:
Journal of Molecular Catalysis A: Chemical,2012年,Vol.363-364,pp.254-264
Chemical Papers,2014年,Vol.68, No.11,pp.1593-1600
Russian Journal of General Chemstry,2015年,Vol.85, No.4,pp.989-992
Journal the Chemical Society,1951年,pp.251-255
Chemical Papers,2014年,Vol.68, No.11,pp.1593-1600
Russian Journal of General Chemstry,2015年,Vol.85, No.4,pp.989-992
Journal the Chemical Society,1951年,pp.251-255
Attorney, Agent or Firm:
Yoshiyuki Inaba
Toshifumi Onuki
Kazuhiko Naito
Toshifumi Onuki
Kazuhiko Naito
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