Title:
化合物
Document Type and Number:
Japanese Patent JP6771802
Kind Code:
B2
Abstract:
The present application relates to a curable composition, a cured product and uses of the curable composition and the cured product. By comprising the curable compound having a certain structure, the present application can provide a curable composition which can increase cohesiveness of the cured product without increasing viscosity of the composition before curing, also minimize the increase of the elastic modulus, and also minimize the ratio of a nonreactive oligomer with an effect of improving the interfacial adhesion. The curable composition can be applied to a variety of optical applications and can be usefully used, for example, for bonding various optical functional members in a display device, for example, for directly bonding a touch panel and a display panel.
Inventors:
Ji Young Lee
Ji Young Fan
Se U Yang
Ji Young Fan
Se U Yang
Application Number:
JP2018540871A
Publication Date:
October 21, 2020
Filing Date:
March 31, 2017
Export Citation:
Assignee:
LG HAUSYS,LTD.
International Classes:
C08G65/332; C08F290/06; C09J171/02
Domestic Patent References:
| JP2001346575A | ||||
| JP2013515791A |
Attorney, Agent or Firm:
Shinya Mitsuhiro
Takashi Watanabe
Takashi Watanabe