化合物、硬化性組成物および硬化膜 - National University Corporation Tokyo Institute of Technology

Title:

化合物、硬化性組成物および硬化膜

Document Type and Number:

Japanese Patent JP2024056244

Kind Code:

A

Abstract:

【課題】低い誘電率および誘電正接の値を有し、かつ、耐熱性および金属等との接着性に優れる硬化物を形成することができる化合物を提供すること。【解決手段】下記式（１）で表される化合物。TIFF2024056244000011.tif66156［Ｒ１～Ｒ１５の内の少なくとも二つ以上はエチレン性不飽和結合を有する。］【選択図】なし

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Inventors:

Hifumi Ryosuke
Ikuyoshi Tomita
Shintaro Fujitomi
Yoichiro Maruyama

Application Number:

JP2022162988A

Publication Date:

April 23, 2024

Filing Date:

October 11, 2022

Export Citation:

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Assignee:

National University Corporation Tokyo Institute of Technology
JSR CORPORATION

International Classes:

C07F9/53; C08F30/02

Attorney, Agent or Firm:

Patent Attorney Corporation SS International Patent Office

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