Title:
化合物、高分子化合物、レジスト材料及びパターン形成方法
Document Type and Number:
Japanese Patent JP4085034
Kind Code:
B2
Abstract:
There is disclosed a polymer containing at least a repeating unit represented by the following general formula (1), and the resist composition containing the polymer as a base resin, especially a chemically amplified resist composition. There can be provided a resist composition which has etching resistance in a practical use level, and is excellent in an adhesion property with a substrate and an affinity with a developer, and has a sensitivity and resolving power which is far excellent compared with a conventional one, wherein swelling is small at the time of development, especially for photolithography which uses a high-energy beam as a light source, and especially be provided a chemically amplified resist composition
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Inventors:
Koji Hasegawa
Tsuyoshi Kanao
Tsuyoshi Kanao
Application Number:
JP2003276319A
Publication Date:
April 30, 2008
Filing Date:
July 17, 2003
Export Citation:
Assignee:
Shin-Etsu Chemical Co., Ltd.
International Classes:
C08F20/10; C07D307/00; G03F7/004; C07D307/93; C07D493/18; C08F32/08; C08F220/18; C08F220/26; C08F222/06; C08F232/08; G03C1/76; G03F7/039; H01L21/027
Domestic Patent References:
| JP2002371080A | ||||
| JP2002308867A | ||||
| JP2005008757A | ||||
| JP2027660B2 | ||||
| JP9073173A | ||||
| JP10010739A |
Attorney, Agent or Firm:
Mikio Yoshimiya