Title:
化合物及び感放射線性組成物
Document Type and Number:
Japanese Patent JP5277966
Kind Code:
B2
Abstract:
A compound shown by the following formula (1) can be used as a material for a radiation-sensitive composition capable of forming a resist film which effectively responds to electron beams or the like, exhibits low roughness, and can form a high precision minute pattern in a stable manner.
Inventors:
Daisuke Shimizu
Maruyama Lab
Toshiyuki Kai
Tsutomu Shimokawa
Maruyama Lab
Toshiyuki Kai
Tsutomu Shimokawa
Application Number:
JP2008553094A
Publication Date:
August 28, 2013
Filing Date:
January 08, 2008
Export Citation:
Assignee:
JSR CORPORATION
International Classes:
C07C43/21; C07C43/23; C07C69/734; C07D307/28; C07D307/32; C07D307/93; G03F7/004; G03F7/039
Domestic Patent References:
| JPH0527430A | 1993-02-05 | |||
| JPS5717661A | 1982-01-29 | |||
| JP4657030B2 | 2011-03-23 | |||
| JPH0527430A | 1993-02-05 | |||
| JPS5717661A | 1982-01-29 |
Foreign References:
| WO2005075398A1 | 2005-08-18 |
Attorney, Agent or Firm:
Ippei Watanabe
Koji Kikawa
Chongqing Sugano
Koji Kikawa
Chongqing Sugano