Title:
COMPRESSION MOLDING APPARATUS AND COMPRESSION MOLDING METHOD
Document Type and Number:
Japanese Patent JP2023003677
Kind Code:
A
Abstract:
To provide a compression molding apparatus and a compression molding method, capable of changing the number of molded products to be taken out per encapsulation mold.SOLUTION: A compression molding apparatus 1 integrally encapsulates three or less of work-pieces W with resin R, using an encapsulation mold 202 provided with three sets of cavities 208 in one of an upper die 204 and a lower die 206 and provided with three sets of work-piece holding parts 205 corresponding to the other. The compression molding apparatus comprises: a preparation section 101 that prepares the work-pieces W; a transport section 210 that transports the work-pieces W from the preparation section 101; a detection section 114 that detects presence of the work-pieces W in the preparation section 101; an arithmetic section 132 that calculates the number of work-pieces W transported into the encapsulation mold 202 based on detection data by the detection section 114; and a control section 130 that selects one of the work-piece holding parts 205 based on number data by the arithmetic section 132 and controls the transport section 210 to transport the work-pieces W and the work-piece holding part 205 to hold the work-pieces.SELECTED DRAWING: Figure 1
Inventors:
TAGAMI SHUSAKU
YANAGISAWA MAKOTO
YANAGISAWA MAKOTO
Application Number:
JP2021104899A
Publication Date:
January 17, 2023
Filing Date:
June 24, 2021
Export Citation:
Assignee:
APIC YAMADA CORP
International Classes:
B29C43/58; B29C43/18; B29C43/34; H01L21/56
Attorney, Agent or Firm:
Watanuki International Patent & Trademark Office