To provide a conductive adhesive forming highly reliable junction of a semiconductor device, and having excellent adhesiveness, electrical conductivity, thermal conductivity, and relaxing thermal stress, and to provide a method of manufacturing a semiconductor device using the same, and the semiconductor device.
The conductive adhesive contains: a plurality of solid conductive particles which contain at least either one of gold, silver, copper, platinum, palladium, rhodium, nickel, iron, cobalt, tin, indium, aluminum, zinc, a compound or an alloy of them having an average particle diameter 0.1-100 μm; solid lubricative particles which are not metal-joined to the solid conductive particles and have a higher lubricity than the solid conductive particles; and water or an organic solvent.
| JP6517915 | Polymer thick silver conductor with reverse curing profile behavior |
| WO/2006/039453 | SILVER NANOPARTICLES MADE IN NON-AQUEOUS SOLVENT |
| JPH11209662 | CONDUCTIVE PASTE |
Tadahiko Inaba
Kanako Murakami
Nakatsuru Kazutaka