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Title:
CONDUCTIVE ADHESIVE SHEET
Document Type and Number:
Japanese Patent JP2017057256
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a conductive adhesive sheet for sticking to living matters having excellent adhesiveness as well as capable of suppressing reduction of surface resistance with time, exhibiting stable conductivity and suppressing proliferation of saprophyte or the like.SOLUTION: A conducive adhesive sheet 1A comprises an adhesive layer 11 containing an adhesive resin and a conductive filler, and is used for application for sticking to living matters. The content of a volatile component contained in the adhesive layer 11 is less than 5.0 mass%, surface resistivity (ρ) of the adhesive layer is 1.0×10Ω/sq. or less, and adhesive force to an adherend made of a phenol resin is 5.0 N/25 mm or more.SELECTED DRAWING: Figure 1

Inventors:
TATSUNO TOMOKO
OTAKA SHO
UEDA TAKAHIRO
Application Number:
JP2015181657A
Publication Date:
March 23, 2017
Filing Date:
September 15, 2015
Export Citation:
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Assignee:
LINTEC CORP
International Classes:
C09J7/00; C09J7/02; C09J9/02; C09J11/02; C09J11/08; C09J121/00; C09J125/00; C09J201/00; H01B1/20; H01B1/24
Domestic Patent References:
JP2015504569A2015-02-12
JP2012169456A2012-09-06
JP2004107378A2004-04-08
JP2001259044A2001-09-25
JP2014240457A2014-12-25
Foreign References:
WO2014152689A22014-09-25
WO2014007353A12014-01-09
Attorney, Agent or Firm:
Tamotsu Otani
Makoto Kataoka
Toshihide Ishihara



 
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