Title:
導電性バンプ、及び無電解Ｐｔめっき浴
Document Type and Number:
Japanese Patent JP7148300
Kind Code:
B2
Abstract:
The present invention provides a bump that can prevent diffusion of a metal used as a base conductive layer of the bump into a surface of an Au layer or an Ag layer. A conductive bump of the present invention is a conductive bump formed on a substrate. The conductive bump comprises, at least in order from the substrate:a base conductive layer;a Pd layer;a Pt layer; andan Au layer or an Ag layer having directly contact with the Pd layer, wherein a diameter of the conductive bump is 20 μm or less.
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Inventors:
Takuma Maekawa
Yukinori Oda
Toshiaki Shibata
Yoshito Ii
Sho Kanzaki
Yukinori Oda
Toshiaki Shibata
Yoshito Ii
Sho Kanzaki
Application Number:
JP2018132514A
Publication Date:
October 05, 2022
Filing Date:
July 12, 2018
Export Citation:
Assignee:
Uemura Industry Co., Ltd.
International Classes:
H01L21/60; C23C18/44; C23C18/52; H05K1/09
Domestic Patent References:
| JP2008547205A | ||||
| JP2001127102A | ||||
| JP2003297868A | ||||
| JP2006291242A | ||||
| JP11160275A | ||||
| JP2016089190A | ||||
| JP2014209508A |
Foreign References:
| WO2009122867A1 | ||||
| WO2016002455A1 |
Attorney, Agent or Firm:
Asfi International Patent Office
Ueki Kuichi
Ueki Hisahiko
Tadashi Sugawa
Hiroaki Ito
Ueki Kuichi
Ueki Hisahiko
Tadashi Sugawa
Hiroaki Ito