Title:
導電性組成物ならびにメタライズド基板およびその製造方法
Document Type and Number:
Japanese Patent JP7293161
Kind Code:
B2
Abstract:
To provide a conductive composition capable of forming a conductive part having high adhesion to a ceramic substrate.SOLUTION: The conductive composition is prepared by combining: metal particles (A) comprising Ag particles (A1) and composite particles (A2) of Ag and Pd; glass particles (B); and a metal component (C) containing an Mn component (C1), an Fe component (C2) and a Cu component (C3). The metal component (C) contains an organometallic compound. The ratio of the metal component (C) may be 0.2-3 pts.mass based on 100 pts.mass of the metal particles (A) in terms of metal elements. The glass particles (B) may include borosilicate glass particles and/or zinc-based glass particles. The conductive composition may be prepared by adding the organometallic compound in the form of a liquid composition.SELECTED DRAWING: None
Inventors:
Taiki Tomiga
Application Number:
JP2020053166A
Publication Date:
June 19, 2023
Filing Date:
March 24, 2020
Export Citation:
Assignee:
Mitsuboshi Belting Co., Ltd.
International Classes:
H01B1/22; C04B41/88; H01B5/14; H01B13/00; H05K1/09
Domestic Patent References:
| JP2018055767A | ||||
| JP2015207629A | ||||
| JP2002231049A | ||||
| JP7335402A |
Attorney, Agent or Firm:
Hiroshi Sakanaka
Mitsuo Kuwata
Mitsuo Kuwata