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Title:
CONDUCTIVE COMPOUNDING MATERIAL AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JPH0541113
Kind Code:
A
Abstract:

PURPOSE: To obtain a conductive resin molded body for electromagnetic waves and x-ray shields by providing conductive property by melting and dispersing metal which is mixed in resin at the time the non-conductive resin is melted and molded.

CONSTITUTION: Regarding a conductive composite material the conductivity of which is provided by melting and dispersing a metal mixed in a non-conductive resin at the time the resin is melted and molded, the composite material is composed of a component having a melting point higher than the molding temperature at the time of molding the resin and a high melting point body at least surface of which is made of a metal having a melting point higher than the molding temperature and which is coated with a low melting point metal layer made of a metal having a low melting point and being a solid at normal temperature. Regarding a molded body obtained by adding the composite material to a resin and melting and molding the resulting mixture, the low melting point metal layer formed on the surface of the high melting point body is spread toward the flowing direction of the molten resin and dispersed like a net and thus the molded body can have good conductive property and orientation of the conduction is surely solved.


Inventors:
MIYAHARA MASAAKI
TAKEUCHI YASUHIKO
Application Number:
JP32516891A
Publication Date:
February 19, 1993
Filing Date:
November 13, 1991
Export Citation:
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Assignee:
NISSEI PLASTICS IND CO
International Classes:
H01B1/22; H01B5/16; H01R13/648; H05K9/00; (IPC1-7): H01B1/22; H01B5/16; H01R13/648; H05K9/00
Domestic Patent References:
JPH01149902A1989-06-13
JPS61206107A1986-09-12
JPS6320270A1988-01-27
JPS61185806A1986-08-19
Attorney, Agent or Firm:
Takao Watanuki (1 outside)