Title:
CIRCUIT BOARD CONDUCTIVE FILM, CIRCUIT BOARD FILM, METHOD FOR MANUFACTURING CIRCUIT BOARD CONDUCTIVE FILM, AND METHOD FOR MANUFACTURING CIRCUIT BOARD FILM
Document Type and Number:
Japanese Patent JP2023145297
Kind Code:
A
Abstract:
To provide a circuit board conductive film excellent in adhesion between a base material and a laminate (a seed layer) and capable of being suitably used for a circuit board; a circuit board film; a method for manufacturing the circuit board conductive film; and a method for manufacturing the circuit board film.SOLUTION: A circuit board conductive film includes a base material, and a laminate provided on the side of at least one surface of the base material. The laminate includes a seed layer and a thin film copper layer in this order from the base material side. The seed layer includes copper, nickel, nitrogen, and oxygen; and in the seed layer, the content of oxygen (O) calculated from the intensity of a characteristic X ray discharged with outer shell electron transition to the K shell being the innermost shell from an outer shell by EDX elemental analysis at an accelerating voltage of 10 kV is 2.3-7.7 mass%, and the content of nitrogen (N) is 1.4-6.8 mass%.SELECTED DRAWING: Figure 1
Inventors:
MATSUNO TOMOAKI
TAMAKI SAKINO
TAMAKI SAKINO
Application Number:
JP2022100487A
Publication Date:
October 11, 2023
Filing Date:
June 22, 2022
Export Citation:
Assignee:
OIKE KOGYO KK
International Classes:
C23C14/14; B32B9/00; B32B15/20; H01B5/14; H01B13/00
Attorney, Agent or Firm:
Patent Attorney Corporation Asahina Patent Office