Title:
導電性フィルム、および、そのパターニング方法
Document Type and Number:
Japanese Patent JP7114446
Kind Code:
B2
Abstract:
An object of the present invention is to provide a transparent conductive film and a patterning method thereof, which have excellent stability of a copper layer and are capable of easily being patterned and suppressing damage to a metal layer in a transparent conductive layer. To achieve the object of the present invention, a conductive film (1) includes: a transparent base material (2); a transparent conductive layer (3) which is disposed on the transparent base material (2) and has a first inorganic oxide layer (6), a metal layer (7) and a second inorganic oxide layer (8) in order; a copper layer (4) arranged on the upper side of the transparent conductive layer (3); and a copper oxide layer (5) arranged on the upper side of the copper layer (4).
Inventors:
Ryuhei Katayama
Keisuke Matsumoto
Takehiko Ando
Keisuke Matsumoto
Takehiko Ando
Application Number:
JP2018222015A
Publication Date:
August 08, 2022
Filing Date:
November 28, 2018
Export Citation:
Assignee:
NITTO DENKO CORPORATION
International Classes:
B32B9/00; C23F1/02; C23F1/14; G06F3/041; H01B5/14; H01B13/00
Domestic Patent References:
| JP2018181722A | ||||
| JP2016210192A | ||||
| JP2016155377A | ||||
| JP20131009A |
Foreign References:
| WO2016208654A1 | ||||
| US20180181232 | ||||
| CN107709000A |
Attorney, Agent or Firm:
Hiroyuki Okamoto
Shinichi Uda
Shinichi Uda