Title:
CONDUCTIVE HEAT TRANSFER BOARD, MANUFACTURING METHOD THEREFOR, AND CIRCUIT MODULE USING THE BOARD
Document Type and Number:
Japanese Patent JP2008205344
Kind Code:
A
Abstract:
To provide a conductive heat transfer board which is mounted on a conductive heat transfer board, having enhanced heat dissipation effect for a heating part, and to provide its manufacturing method and a circuit module that uses this.
In the constitution, an opening 15 is formed in a metal plate 12, a heating part 10 is inserted into the opening 15 so that a bottom face of the heating part 10 is pressed against a chassis 18 as a frame body of the apparatus. The heat can be dissipated from not only the upper and the lower faces of the heating part 10 but also side faces by a bent portion 16 via a mounting portion, so the cooling effect of the heating part 10 can be enhanced.
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Inventors:
NAKADA TOSHIYUKI
NAKAJIMA KOJI
ONISHI TORU
NAKAGAWA MASARU
YAMANOUCHI TATSUICHI
NAKAJIMA KOJI
ONISHI TORU
NAKAGAWA MASARU
YAMANOUCHI TATSUICHI
Application Number:
JP2007041892A
Publication Date:
September 04, 2008
Filing Date:
February 22, 2007
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
H01L23/36; H01L23/40; H05K7/20
Attorney, Agent or Firm:
Fumio Iwahashi
Hiroki Naito
Daisuke Nagano
Hiroki Naito
Daisuke Nagano
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