導電材料、接続構造体及び接続構造体の製造方法

Title:

導電材料、接続構造体及び接続構造体の製造方法

Document Type and Number:

Japanese Patent JP7474029

Kind Code:

B2

Abstract:

To provide a conductive material that allows solder to be efficiently disposed on an electrode, and can effectively improve conduction reliability between vertical electrodes to be connected.SOLUTION: A conductive material has a thermosetting component and a solder particle. An absolute difference between a solidus temperature of the solder particle and a liquidus temperature of the solder particle is 5°C or more. In the conductive material 100 wt.%, the content of the solder particles is 15 wt.% or more.SELECTED DRAWING: Figure 1

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Inventors:

Danichi Miyazaki
Hidefumi Yasui
Shujiro Sadanaga

Application Number:

JP2019038350A

Publication Date:

April 24, 2024

Filing Date:

March 04, 2019

Export Citation:

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Assignee:

Sekisui Chemical Co.,Ltd.

International Classes:

H01B1/22; B23K35/26; C22C12/00; C22C13/00; C22C13/02; C22C28/00; H01B5/16; H01R11/01; H01R43/00

Domestic Patent References:

JP2015530705A

Foreign References:

WO2017033930A1

Attorney, Agent or Firm:

Patent Attorney Osaka Front Patent Office

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