Title:
導電材料、導電ペースト、回路基板、及び半導体装置
Document Type and Number:
Japanese Patent JP5212462
Kind Code:
B2
Abstract:
A conductive material includes a first metal part whose main ingredient is a first metal; a second metal part formed on the first metal part and whose main ingredient is a second metal, the second metal having a melting point lower than a melting point of the first metal, which second metal can form a metallic compound with the first metal; and a third metal part whose main ingredient is a third metal, which third metal can make a eutectic reaction with the second metal.
Inventors:
Seiki Sakuyama
Taiji Sakai
Taiji Sakai
Application Number:
JP2010501747A
Publication Date:
June 19, 2013
Filing Date:
March 07, 2008
Export Citation:
Assignee:
富士通株式会社
International Classes:
H01B5/00; B22F1/00; B22F1/02; H01B1/22; H01L21/60; H05K1/09; H05K1/11; H05K3/32; H05K3/34; H05K3/46
Domestic Patent References:
| JP2005005630A | 2005-01-06 | |||
| JP2005302845A | 2005-10-27 | |||
| JP2002194464A | 2002-07-10 | |||
| JP2007081141A | 2007-03-29 | |||
| JPH10126022A | 1998-05-15 | |||
| JP2005005630A | 2005-01-06 | |||
| JP2005302845A | 2005-10-27 | |||
| JP2002194464A | 2002-07-10 | |||
| JP2007081141A | 2007-03-29 |
Foreign References:
| WO2006085481A1 | 2006-08-17 | |||
| WO2004022663A1 | 2004-03-18 | |||
| WO2006085481A1 | 2006-08-17 | |||
| WO2004022663A1 | 2004-03-18 |
Attorney, Agent or Firm:
Tadahiko Ito
Previous Patent: JPS5212461
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