Title:
CONDUCTIVE METAL PASTE
Document Type and Number:
Japanese Patent JP2013218829
Kind Code:
A
Abstract:
To provide a conductive metal paste capable of suppressing generation of dripping and bleeding even when the conductive metal paste is thickly coated on a surface of a substrate, while metal wiring obtained by firing the coated conductive metal paste has excellent adhesion with the substrate.
A conductive metal paste of the present invention includes: a low polar solvent; a metal fine particle having a surface coated with a dispersant; a polyimide varnish; and further a fatty acid amide as a surfactant.
More Like This:
| JP2017514313 | Conductive paste, electrodes and solar cells |
| JP2022117824 | CONDUCTIVE ADHESIVE |
| JPWO2016088540 | Conductive composition, wiring board and its manufacturing method |
Inventors:
OSAWA MASATO
HASHIMOTO NATSUKI
HAYASHI YOSHIAKI
KANAZAWA KEISUKE
SAKIO SUSUMU
HASHIMOTO NATSUKI
HAYASHI YOSHIAKI
KANAZAWA KEISUKE
SAKIO SUSUMU
Application Number:
JP2012086828A
Publication Date:
October 24, 2013
Filing Date:
April 05, 2012
Export Citation:
Assignee:
ULVAC CORP
International Classes:
H01B1/22; B22F1/00; B22F1/02; H01B1/00; H05K3/12
Domestic Patent References:
| JP2009040969A | 2009-02-26 | |||
| JPS63317333A | 1988-12-26 | |||
| JP2007246897A | 2007-09-27 | |||
| JP2009040969A | 2009-02-26 | |||
| JPS63317333A | 1988-12-26 | |||
| JP2007246897A | 2007-09-27 |
Foreign References:
| WO2002035554A1 | 2002-05-02 | |||
| WO2005116152A1 | 2005-12-08 | |||
| WO2002035554A1 | 2002-05-02 | |||
| WO2005116152A1 | 2005-12-08 |
Attorney, Agent or Firm:
Seiryu Corporation