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Patent Searching and Data


Title:
CONDUCTIVE MOLDING AND PRODUCTION THEREOF
Document Type and Number:
Japanese Patent JPH03257171
Kind Code:
A
Abstract:

PURPOSE: To provide a stable and good electrical conductivity by heating or pressurizing the fine particles of a thermoplastic resin coated with a conductive material layer.

CONSTITUTION: The electrical conductivity is obtd. by forming the conductive material layer on the surfaces of the fine particles of the thermoplastic resin, then heating or pressurizing and welding the fine particles. Consequently, the molding assures conduction by the contact of the grain boundaries and maintains the conduction path by generating the bonding of the thermoplastic resin to each other within the fine particles by the slight breakdown of the conductive layers. The electrical conductivity is, therefore, always assured at the grain boundaries and the influence by external factors is decreased.


Inventors:
IDE KAZUHIKO
Application Number:
JP5576290A
Publication Date:
November 15, 1991
Filing Date:
March 07, 1990
Export Citation:
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Assignee:
TOYO INK MFG CO
International Classes:
C23C18/31; H01B1/22; (IPC1-7): C23C18/31; H01B1/22
Domestic Patent References:
JPS5761026A1982-04-13
JPS53126094A1978-11-02
JPS56152812A1981-11-26
JPS62119211A1987-05-30