Title:
CONDUCTIVE PARTICLE, CONDUCTIVE MATERIAL AND CONNECTION STRUCTURE
Document Type and Number:
Japanese Patent JP2015057757
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a conductive particle capable of lowering connection resistance when used for electrical connection between electrodes comprising titanium electrodes.SOLUTION: The conductive particle 1 is used for electrical connection of titanium electrodes and is characterized in that: the conductive particle 1 has a conductive portion 3 at least on the surface; the conductive portion 3 has a plurality of protrusions 3a on the surface; and the conductive particle 1 has a compressive modulus of 9000 N/mmor more when compressed by 10%, the conductive particle 1 has a compressive modulus of 8000 N/mmor more when compressed by 20%, the conductive particle 1 has a compressive modulus of 7000 N/mmor more when compressed by 30%, and the conductive particle 1 has a compressive recovery rate of 60% or more and 90% or less.
Inventors:
NISHIOKA KEIZO
NAGAI YASUHIKO
YAMADA YASUYUKI
ARIMURA KEITA
DOBASHI YUTO
NAGAI YASUHIKO
YAMADA YASUYUKI
ARIMURA KEITA
DOBASHI YUTO
Application Number:
JP2013246345A
Publication Date:
March 26, 2015
Filing Date:
November 28, 2013
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD
International Classes:
H01B5/00; C09D5/24; C09D7/12; C09D201/00; C09J9/02; C09J11/04; C09J11/06; C09J201/00; H01B1/00; H01B1/22; H01B5/16; H01R11/01
Domestic Patent References:
| JPH0436902A | 1992-02-06 | |||
| JP2003212534A | 2003-07-30 | |||
| JP2013149613A | 2013-08-01 | |||
| JP2013045737A | 2013-03-04 | |||
| JP2000243132A | 2000-09-08 |
Foreign References:
| WO2007058159A1 | 2007-05-24 | |||
| WO2009017200A1 | 2009-02-05 |
Attorney, Agent or Firm:
Patent business corporation Miyazaki and table-of-contents patent firm