Title:
CONDUCTIVE PASTE FOR CERAMIC WIRING BOARD
Document Type and Number:
Japanese Patent JP2933463
Kind Code:
B2
Abstract:
PURPOSE: To prevent microcracks, which occur at the interface between metal and ceramic, by adding cavity molding materials such as high polymers to the conductive paste consisting of metallic particles and organic vehicles and scattering them at baking.
CONSTITUTION: Silver, as a conductor metal for a via hole, and polystyrene, as a cavity molding material, and silver, as a metallic particles, are applied, and the silver and organic vehicles are mixed, and further polystyrene is added as a material for molding a cavity 30vol.% or under. Hereby, the occurrence of microcracks at the interface between metal and an insulator can be prevented after baking and heat treatment while maintaining resistivity and high reliability.
Inventors:
HO KEIICHIRO
SHIBUYA AKINOBU
SHIBUYA AKINOBU
Application Number:
JP12563293A
Publication Date:
August 16, 1999
Filing Date:
May 27, 1993
Export Citation:
Assignee:
NIPPON DENKI KK
International Classes:
H01B1/16; H05K1/09; H05K1/14; H05K3/40; H05K3/46; (IPC1-7): H01B1/16; H05K3/40; H05K3/46
Domestic Patent References:
| JP4225297A | ||||
| JP3138806A | ||||
| JP225094A |
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)
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