Title:
CONDUCTIVE PASTE COMPOSITION FOR VIA HOLE CONDUCTOR
Document Type and Number:
Japanese Patent JP3034238
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide conductive paste having viscosity suitable for forming a via hole conductor in a wiring board.
SOLUTION: As components for conductive paste, at least conductive powder and organic binder of a fusing point of -15°C to 40°C are contained for producing the condutive paste having viscosity of excellent filling performance, easily achieving viscosity of excellent form holding performance, providing favorable appearance, and producing a wiring board having a via hole conductor 13 of a fine pitch.
Inventors:
Yuji Iino
Katsura Hayashi
Katsura Hayashi
Application Number:
JP27126198A
Publication Date:
April 17, 2000
Filing Date:
September 25, 1998
Export Citation:
Assignee:
Kyocera Corporation
International Classes:
H05K3/46; H01B1/20; H01B1/22; H05K1/11; H05K3/40; (IPC1-7): H01B1/22; H05K1/11; H05K3/40; H05K3/46
Domestic Patent References:
| JP224907A | ||||
| JP532755A | ||||
| JP987419A | ||||
| JP10107445A |