Title:
CONDUCTIVE PASTE, CONDUCTIVE FILM AND TOUCH PANEL
Document Type and Number:
Japanese Patent JP2015069877
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a conductive paste having high viscosity and fine line printability and further capable of achieving high moisture heat reliability and low temperature dryability in a screen printing method.SOLUTION: There is provided a conductive paste containing a thermoplastic resin (A) and a thermoplastic resin (B), conductive metal powder (C) and an organic solvent (D), a number average molecular weight of the thermoplastic resin (A), Mn(A) is 10,000 to 70,000, a ratio of the number average molecular weight of the thermoplastic resin (A), Mn(A) and the number average molecular weight of the thermoplastic resin (B), Mn(B), Mn(A)/Mn(B) is 5 to 100, a ratio of a weight fraction of the thermoplastic resin (A), W(A) and the weight fraction of the thermoplastic resin (B), W(B), W(A)/W(B) of 1 to 20 and the weight fraction of the organic solvent (D) based on the total weight of the conductive paste is 25 wt.% or less.
Inventors:
HAMAZAKI AKIRA
Application Number:
JP2013204076A
Publication Date:
April 13, 2015
Filing Date:
September 30, 2013
Export Citation:
Assignee:
TOYO BOSEKI
International Classes:
H01B1/22; B32B27/18; B32B27/20; C08G18/65; C08K3/08; C08L67/00; C08L75/04; G06F3/041; H01B5/14
Domestic Patent References:
| JP2005126505A | 2005-05-19 | |||
| JP2013125588A | 2013-06-24 | |||
| JP2012216533A | 2012-11-08 | |||
| JP2005056778A | 2005-03-03 |