Title:
導電性ペーストおよび積層型電子部品並びにその製法
Document Type and Number:
Japanese Patent JP4548897
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a conductive paste and laminated electronic components, and their manufacturing method, with which the deterioration of an insulation resistance can be suppressed, even when a dielectric layer is made thin. SOLUTION: This conductive paste is made mainly of Ni powder and desirably contains a Cr powder of 0.01 wt.% or less in all metallic elements, and a Co powder of 0.05 wt.% or less in all metallic elements.
Inventors:
Kenichi Iwasaki
Application Number:
JP2000096539A
Publication Date:
September 22, 2010
Filing Date:
March 31, 2000
Export Citation:
Assignee:
Kyocera Corporation
International Classes:
H01G4/12; H01B1/22; H01G4/30
Domestic Patent References:
| JP10214520A | ||||
| JP11111564A | ||||
| JP11144993A | ||||
| JP5144608A | ||||
| JP10144559A | ||||
| JP11135357A |