Title:
導電性ペーストおよび積層型電子部品
Document Type and Number:
Japanese Patent JP7369008
Kind Code:
B2
Abstract:
Provided is a conductive paste capable of providing a lower electrode layer with high moisture resistance by baking. According to the present invention, the conductive paste (1) comprises: a conductive powder (2) containing at least one element selected from Cu and Ni; glass powder (3); and an organic material (4). The glass powder (3) includes a borosilicate-based glass composition. When the amount of elements contained in the borosilicate-based glass composition is expressed in mole%, the existence ratio of tetracoordinate B (R_B4), which is expressed by C_B4/(C_B4 + C_B3), satisfies 0.35 <= R_B4 <= 0.80, wherein the amount of tetracoordinate B is C_B4 and the amount of tricoordinate B is C_B3.
Inventors:
Kazuya Taga
Yasuhiro Nishisaka
Hitoshi Nishimura
Yasuhiro Nishisaka
Hitoshi Nishimura
Application Number:
JP2019195916A
Publication Date:
October 25, 2023
Filing Date:
October 29, 2019
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
H01B1/22; H01B1/00; H01G4/30
Domestic Patent References:
| JP2019055888A | ||||
| JP2001064081A |
Attorney, Agent or Firm:
Patent Attorney Fukami Patent Office
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