Title:
レーザーエッチング加工用導電性ペースト、電気回路およびタッチパネル
Document Type and Number:
Japanese Patent JP5773298
Kind Code:
B2
Abstract:
[Problem] To provide a conductive paste for laser etching, which is suitable for laser etching that is capable of producing a high-density electrode circuit wiring line having an L/S of 50/50 mum or less at low cost with a little burden on the environment, said high-density electrode circuit wiring line having been considered difficult to be produced by conventional screen printing methods. [Solution] A conductive paste for laser etching, which contains (A) a binder resin that is formed of a thermoplastic resin, (B) a metal powder and (C) an organic solvent; a conductive thin film that is formed using the conductive paste; a conductive laminate; an electrical circuit; and a touch panel.
Inventors:
Ryo Hamasaki
Shintaro Ohmae
Shintaro Ohmae
Application Number:
JP2014257177A
Publication Date:
September 02, 2015
Filing Date:
December 19, 2014
Export Citation:
Assignee:
Toyobo Co., Ltd.
International Classes:
B32B27/18; H01B1/22; C08K3/08; C08L67/00; C08L75/00; C09D5/24; C09D167/00; C09D175/00; G06F3/041; H01B5/14; H05K1/09; H05K3/08
Domestic Patent References:
| JP2014002992A | ||||
| JP2004083759A | ||||
| JP2008184477A |