Title:
CONDUCTIVE PASTE AND METHOD FOR FORMING CONDUCTIVE PATTERN
Document Type and Number:
Japanese Patent JP2016031804
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a conductive paste which enables printing even in a narrower line width, can form a conductive pattern and contains a polyester resin and a block polyisocyanate compound.SOLUTION: A conductive paste for printing a conductive pattern contains: conductive metal particles (A); a polyester resin (B) which is a solid at 50°C; polyester diol (C) which is a liquid at 50°C; a block polyisocyanate compound (D); and an organic solvent (E) which has not reactivity with (A) to (D) and has a boiling point of 170-300°C at normal pressure. A method for forming a conductive pattern with a gravure offset printing method uses the conductive paste.SELECTED DRAWING: None
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Inventors:
SENTE YASUHIRO
SUGANO TSUTOMU
KATAYAMA YOSHINORI
SUGANO TSUTOMU
KATAYAMA YOSHINORI
Application Number:
JP2014152873A
Publication Date:
March 07, 2016
Filing Date:
July 28, 2014
Export Citation:
Assignee:
DAINIPPON INK & CHEMICALS
International Classes:
H01B1/22; H01B13/00; H01L23/14; H05K3/12
Domestic Patent References:
| JP2012022798A | 2012-02-02 | |||
| JP2011096225A | 2011-05-12 |
Foreign References:
| WO2015046096A1 | 2015-04-02 |
Attorney, Agent or Firm:
Kono Tsuyo
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