Title:
Conductive paste and pattern forming method
Document Type and Number:
Japanese Patent JP6338200
Kind Code:
B2
More Like This:
Inventors:
Mayu Ogawa
Application Number:
JP2014133994A
Publication Date:
June 06, 2018
Filing Date:
June 30, 2014
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
H01B1/22; B05D5/12; B05D7/24; H01B13/00; H05K1/09; H05K3/12
Domestic Patent References:
JP6169140A | ||||
JP2012091216A | ||||
JP8138969A | ||||
JP2005063975A |
Foreign References:
WO2010109541A1 | ||||
WO2013100084A1 |
Attorney, Agent or Firm:
Kunihiro Yasutoshi