Title:
CONDUCTIVE PASTE AND SUBSTRATE HAVING CONDUCTIVE FILM
Document Type and Number:
Japanese Patent JP2015133182
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a conductive paste capable of forming a conductive film having good conductivity, excellent folding resistance, and excellent high-temperature and high-humidity durability, and to provide a substrate having a conductive film formed by using the conductive paste.SOLUTION: There is provided a conductive paste including: (A) metal particles having a high volume specific resistance value of 10 μΩ cm or less and an average particle diameter of 0.5 to 15 μm; (B) a phthalate compound represented by (ROOC)-CH-(COOR') (in the formula, R and R' represent independently from each other an alkyl group having 3 to 20 carbon atoms, provided that the total number of carbon atoms of the alkyl group is 40 or less); and (C) a binder resin comprising a thermosetting resin having benzene rings. The metal particles of the (A) component are surface-coated with a fatty acid having 8 to 20 carbon atoms. The conductive paste comprises 5 to 25 pts.mass of the (C) component of the binder resin and 0.01 to 2.5 pts.mass of the (B) component of the phthalate compound based on a total of 100 pts.mass of the whole components of the conductive paste.
Inventors:
AKAMA YUKI
HIRAKOSO HIDEYUKI
HIRAKOSO HIDEYUKI
Application Number:
JP2014002534A
Publication Date:
July 23, 2015
Filing Date:
January 09, 2014
Export Citation:
Assignee:
ASAHI GLASS CO LTD
International Classes:
H01B1/22; C08K3/08; C08K5/12; C08K9/04; C08L101/02; C09D11/52; H01B5/14; H05K1/09
Attorney, Agent or Firm:
Nozomi Watanabe
Haruko Sanwa
Takemoto Yoichi
Haruko Sanwa
Takemoto Yoichi