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Patent Searching and Data


Title:
CONDUCTIVE PASTE
Document Type and Number:
Japanese Patent JP2015079725
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an excellent conductive paste that can be coated or printed and further can be stretched, and in addition that can realize a conductive film of high conductivity.SOLUTION: Provided is a conductive paste in which a conductive filler (B) is uniformly dispersed in a resin (A), in which it is characterized: the resin (A) is a rubber emulsion selected from a group consisting of a water dispersion (A1) of a conjugated double bond polymer comprising aromatic group-containing polymer polyanion as dopant, a sulfur atom-containing rubber emulsion (A2) and a nitrile group-containing rubber emulsion (A3); the conductive filler (B) is a metal powder (B1) having an average particle diameter of 0.5 to 10 μm; and the blended amounts of resin (A) and conductive filler (B) in the conductive paste solid content is 50 to 80 vol.% and 20 to 50 vol.%, respectively.

Inventors:
IMAHASHI SATOSHI
Application Number:
JP2013237636A
Publication Date:
April 23, 2015
Filing Date:
November 18, 2013
Export Citation:
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Assignee:
TOYO BOSEKI
International Classes:
H01B1/22; C09D5/02; C09D5/24; C09D7/12; C09D109/02; C09D125/04; C09D133/14; C09D165/00; C09D181/00; C09D183/08; H01B1/00; H01B5/14; H01B13/00; H05K1/09
Attorney, Agent or Firm:
Nobuaki Kazehaya
Noriko Asano