Title:
導電性ペースト
Document Type and Number:
Japanese Patent JP4791872
Kind Code:
B2
Abstract:
The present invention provides a conductive composition and a conductive paste from which a conductive film having a high conductivity and a low thermal expansion coefficient can be formed. The thermal expansion coefficient of an island fixing type conductive layer 10 is compatible with that of a substrate 12. A cracking of the island fixing type conductive layer 10 or a crack in the substrate 12 due to a difference between these thermal expansion coefficients is suitably inhibited. The thermal expansion coefficient of the island fixing type conductive layer 10 is adjusted by ZWP contained in the range from 10 to 55 (wt %) as a low-expansion filler. Thus, compared with the case where other low-expansion filler is added, the conductivity degradation is inhibited. Accordingly, the island fixing type conductive layer 10 having a high conductivity and a high bonding strength is obtained.
Inventors:
Motoi Iijima
Tatsuro Nishimura
Yu Nakanishi
Tatsuro Nishimura
Yu Nakanishi
Application Number:
JP2006095581A
Publication Date:
October 12, 2011
Filing Date:
March 30, 2006
Export Citation:
Assignee:
Noritake Company Limited
Noritake Ise Electronics Co., Ltd.
Noritake Ise Electronics Co., Ltd.
International Classes:
H01J31/15; C01B25/45; C08K3/32; C08K3/40; C08L1/28; C08L93/04; H01B1/22
Domestic Patent References:
| JP2004355880A | ||||
| JP2005035840A |
Attorney, Agent or Firm:
Haruyuki Ikeda