Title:
CONDUCTIVE PASTE
Document Type and Number:
Japanese Patent JPH08148030
Kind Code:
A
Abstract:
PURPOSE: To ensure electrostatic capacity as designed, and to improve adhesive strength to porcelain formed into a semiconductor.
CONSTITUTION: In conductive paste, conductive metal powder, bismuth oxide powder and borosilicate lead bismuth system glass frit are dispersed as a solid component in an organic vehicle. In this case, compounding ratio relating to the respective solid component total unit of the bismuth oxide powder and the glass frit is set to within each 0.4 to 0.5wt.% range.
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Inventors:
NAKAYAMA YOSHIYUKI
Application Number:
JP29008094A
Publication Date:
June 07, 1996
Filing Date:
November 24, 1994
Export Citation:
Assignee:
MURATA MANUFACTURING CO
International Classes:
H01G4/12; H01B1/16; (IPC1-7): H01B1/16; H01G4/12
Attorney, Agent or Firm:
Kazuhide Okada