Title:
Conductive pressure sensitive adhesive tape and a manufacturing method for the same
Document Type and Number:
Japanese Patent JP6183728
Kind Code:
B2
Abstract:
Provided is a conductive adhesive tape comprising: a substrate that is formed in a nano-web form having a number of pores by spinning a polymer material by a spinning method; and a conductive adhesive layer that is formed in a non-porous form by directly spinning a conductive adhesive material by a spinning method on one or both surfaces of the substrate, or that is laminated on one or both surfaces of the substrate. Accordingly, thickness of the adhesive tape can be made thin, adhesive strength of the adhesive tape can be enhanced, and the adhesive tape can be precisely attached on even a curved surface. Further, when removing the adhesive tape from components, the adhesive layer can be prevented from remaining on the surface of the components.
Inventors:
Seo, In Young
Li, Seunghoon
John, Youngsik
Seo, Yunmi
Li, Seunghoon
John, Youngsik
Seo, Yunmi
Application Number:
JP2015514897A
Publication Date:
August 23, 2017
Filing Date:
May 27, 2013
Export Citation:
Assignee:
Amo Green Tech Company, Limited
International Classes:
B32B5/26; B32B27/00; B32B29/02; C09J7/29; C09J11/04; C09J11/06; C09J201/00; D01D5/04; H05K9/00
Domestic Patent References:
| JP2007245712A | ||||
| JP2010168722A | ||||
| JP2010537438A | ||||
| JP2006123360A | ||||
| JP2009267230A | ||||
| JP2012529574A | ||||
| JP2015514822A |
Foreign References:
| WO2011040752A1 | ||||
| US20060014460 |
Attorney, Agent or Firm:
▲吉▼川 俊雄
Kana Ichikawa
Kana Ichikawa