Title:
CONDUCTIVE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2011032481
Kind Code:
A
Abstract:
To provide a conductive resin composition which is excellent in flexural modulus, strength, volume resistivity value, moldability, molding surface smoothness, and dimensional stability.
The conductive resin composition for an IC tray or a carrier reel is prepared by compounding calcium silicate fibers (d) of 3-40 pts.wt. with average fiber diameter of 1-10 μm and average fiber diameter of 8-70 μm to total volume of 100 pts.wt. of a thermoplastic resin (a) of 80-99.8 pts.wt. and a polyether ester amide of 0.2-20 pts.wt. as a polyether-type nonionic surface-active agent (c) and has the flexural modulus of 1,500 MPa or more.
Inventors:
ENOMOTO MASAKI
Application Number:
JP2010213115A
Publication Date:
February 17, 2011
Filing Date:
September 24, 2010
Export Citation:
Assignee:
RIKEN TECHNOS CORP
International Classes:
C08L101/00; C08K3/34; C08K5/20; H01B1/22
Domestic Patent References:
| JPH11246758A | 1999-09-14 |
Attorney, Agent or Firm:
Hideo Akazawa