To increase conductivity and improve migration resistance by containing conductive powder composed of specific quantities of silver and copper, copper alloy powder having the higher silver concentration on the grain surface than the average silver concentration of grains, and one or more kinds of other conductive powder selected from silver powder, silver alloy powder, and silver-plated copper powder.

The conductive powder combined with copper alloy powder and other conductive powder and having high surface silver concentration is used to manufacture a conductive resin composition. In a conductive paste containing a binder resin of 5-40 pts.wt. against the conductive powder of 100 pts.wt., the conductive powder contains the copper alloy powder of 30-95 pts.wt. expressed by a general formula AgxCuy [0.001≤x≤0.6, 0.4≤y≤0.999 (atomic percentage)] and having the higher silver concentration on the grain surface than the average silver concentration of grains. At least one or more kinds of other conductive powder of 5-70 pts.wt. selected from silver powder, silver alloy powder, and silver-plated copper powder is contained.