Title:
導電性ゴム部品及びその実装方法
Document Type and Number:
Japanese Patent JP5340485
Kind Code:
B2
Abstract:
A conductive rubber component (10) of the present invention includes a metal coating (2) formed on at least one surface located perpendicular to a compression direction of a conductive rubber single body (1) by atomic and/or molecular deposition, and can be surface mounted and soldered. In a method for mounting a conductive rubber component (10) of the present invention, the conductive rubber component (10) is surface mounted on a wiring layer (8) on a printed wiring board (9) and is fixed by a solder layer (7) thereto and thereby is incorporated to electrically connect the printed circuit board (9) and an electronic component (11) to each other. Thus, a conductive rubber component and a method for mounting same are provided, wherein the conductive rubber component is used as an electrical contact of an electronic component compatible with the surface mount technology (SMT), the conductive rubber component does not cause any damage to the electrode surface of the electronic component even when the body of an electronic device in which it is mounted is distorted or warped, it has lower resistance and excellent chemical stability and can be used for SMT.
Inventors:
Toshiki Ogawa
Masakazu Koizumi
Masakazu Koizumi
Application Number:
JP2012530557A
Publication Date:
November 13, 2013
Filing Date:
May 18, 2011
Export Citation:
Assignee:
Fuji Polymer Industry Co., Ltd.
International Classes:
H01R11/01; H01B1/20; H01B5/02; H01R43/02
Domestic Patent References:
| JP4472783B2 | 2010-06-02 | |||
| JPS6182609A | 1986-04-26 | |||
| JP4231899B2 | 2009-03-04 |
Attorney, Agent or Firm:
Ikeuchi, Sato & Partners